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Biying Xu1, Shaolan Li1, Chak-Wa Pui2, Derong Liu3, Linxiao Shen1, Yibo Lin1, Nan Sun1, David Z. Pan1
1 ECE Dept., the University of Texas at Austin 2 CSE Dept., the Chinese University of Hong Kong 3 Cadence Design Systems, Inc.
Device Layer-Aware Analytical Placement for Analog Circuits Biying - - PowerPoint PPT Presentation
The picture can't be displayed. Device Layer-Aware Analytical Placement for Analog Circuits Biying Xu 1 , Shaolan Li 1 , Chak-Wa Pui 2 , Derong Liu 3 , Linxiao Shen 1 , Yibo Lin 1 , Nan Sun 1 , David Z. Pan 1 1 ECE Dept., the University of Texas
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1 ECE Dept., the University of Texas at Austin 2 CSE Dept., the Chinese University of Hong Kong 3 Cadence Design Systems, Inc.
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3 Sources: IBM
Advanced computing Healthcare Communication
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VDD
VBP VBN VBN VBN CC CC CF CF Cs Cs CMFB Bias and CMFB not shown VIP VIN VOP VON 30% area reduction
Layout Phase Margin (deg.) Unity Gain Bandwidth (MHz) Loop Gain (dB) Non-overlap 71.9 103.7 36.3
71.5 105.4 36.3
6 Layout Center Frequency (fCCO) (kHz) Tuning Gain (kCCO) (THz/A) Non-overlap 609 0.89
610 0.90
ICTRL CCO Delay Cell O O ICTRL I I CL CL
30% area reduction
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Vo- Vo+
An analog circuit example
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Circuit Netlist Placement Boundary Placement Result Device Layer-Aware Analog Placement Device Types & Shapes Layout Constraints Global Placement
Constraint Graph Construction Symmetry-Aware Legalization
Legalization Detailed Placement
CG-based Non-linear Optimization Adjust Coefficients in Objective
Overall flow
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3 1 2 6 7 8 5 10 9 4
An analog placement example a symmetric group with vertical symmetric axis
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+, + . / * 0, + " / * 123 + % / * 456 7
456 8
+, = Σ:;(max @∈:; B@ − min @∈:; B@ + max @∈:; F@ − min @∈:; F@)
0, = H @,J ∈,
7 / !@,J 8
7 = max min B@ + K@ − BJ, BJ + K J − B@, K@, K J), 0
8 = max min F@ + ℎ@ − FJ, FJ + ℎJ − F@, ℎ@, ℎJ), 0
OA,B x = xA+wA-xB OA,B y = hB
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,,. ∈()
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6 7 +
7 + ' ,∈()
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(xA,yA) xk c (xB,yB) (xC,yC) A B C i
xL xH xi
13 WNLIB: W. Naylor and B. Chapman, http://www.willnaylor.com/wnlib.html
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D E C A B
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D A B C E
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B C A D E Type I Type II Type III D A B C E
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A D E B C
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D A B C E
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A D E B C E
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A D B C
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A D E B C
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; = 2 A 1B C, ∀ 7, D ∈ EB F,
C, ∀7 ∈ EB G,
F, ∀EB ∈ =,
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C = 2 K 9L M, ∀ (, N ∈ -L O,
M, ∀( ∈ -L P,
O,
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Design NLP Without Device Layer Awareness Device Layer-Aware NLP Area (µm2) HPWL (µm) Run-time (s) Area (µm2) HPWL (µm) Run-time (s) Actual Norm. Actual Norm. Actual Norm. Actual Norm. Actual Norm. Actual Norm.
2972.7 1 753.2 1 17.1 1 2369.9 0.797 497.7 0.661 10.9 0.637 gm-C integrator 182.0 1 72.8 1 1.2 1 175.1 0.962 60.5 0.831 1.2 1.000 CTDSM 57454.5 1 3129.4 1 6.5 1 56059.8 0.976 2580.0 0.824 6.5 0.997 Average 1 1 1 0.912 0.772 0.878
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gm-C integrator CTDSM Circuit Benchmarks 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Normalized Area
NLP Device Layer-Aware NLP
gm-C integrator CTDSM Circuit Benchmarks 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Normalized HPWL
NLP Device Layer-Aware NLP
Wirelength
Actual Norm. Actual Norm.
839 1 617 0.74 gm-C integrator 89 1 79 0.89 CTDSM 3591 1 3034 0.84 Average 1 0.82
gm-C integrator CTDSM Circuit Benchmarks 0.0 0.2 0.4 0.6 0.8 1.0 1.2
Normalized Global Routing Wirelength
NLP + GR Device Layer-Aware NLP + GR
Design NLP-based Placement MILP-based Placement [Xu+, ISPD’17] Area (µm2) HPWL (µm) Run-time (s) Area (µm2) HPWL (µm) Run-time (s) Actual
Actual Norm. Actual Norm. Actual Norm.
2972.7 1 753.2 1 17.1 1 3295.5 1.11 714.0 0.95 607.2 35.57 gm-C integrator 182.0 1 72.8 1 1.2 1 186.8 1.03 69.0 0.95 20.7 17.21 CTDSM 57454.5 1 3129.4 1 6.5 1 57959.9 1.01 3611.5 1.15 20.5 3.16 Average 1 1 1 1.05 1.02 18.65
gm-C integrator CTDSM Circuit Benchmarks 5 10 15 20 25 30 35 Normalized Runtime
MILP NLP
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