Device Layer-Aware Analytical Placement for Analog Circuits Biying - - PowerPoint PPT Presentation

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Device Layer-Aware Analytical Placement for Analog Circuits Biying - - PowerPoint PPT Presentation

The picture can't be displayed. Device Layer-Aware Analytical Placement for Analog Circuits Biying Xu 1 , Shaolan Li 1 , Chak-Wa Pui 2 , Derong Liu 3 , Linxiao Shen 1 , Yibo Lin 1 , Nan Sun 1 , David Z. Pan 1 1 ECE Dept., the University of Texas


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SLIDE 1 The picture can't be displayed.

1

Biying Xu1, Shaolan Li1, Chak-Wa Pui2, Derong Liu3, Linxiao Shen1, Yibo Lin1, Nan Sun1, David Z. Pan1

1 ECE Dept., the University of Texas at Austin 2 CSE Dept., the Chinese University of Hong Kong 3 Cadence Design Systems, Inc.

Device Layer-Aware Analytical Placement for Analog Circuits

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SLIDE 2

Outline

Introduction of Device Layer-Aware Analog Placement Device Layer-Aware Analog Placement

ü Non-linear optimization based global placement ü Linear programming based legalization and detailed placement

Experimental Results Summary

2

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SLIDE 3

Analog IC Trend

High demand in emerging applications: Internet of Things (IOT), autonomous and electric vehicles, communication and 5G networks

3 Sources: IBM

Advanced computing Healthcare Communication

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SLIDE 4

Analog Layout Automation Challenges

Modern SoCs: 20% or less analog, but maybe over 80% design time Analog IC layout design still heavily manual

ü Cf. digital IC layout automation ü Very time-consuming, tedious, and error-prone

Some prior work on analog placement

ü [Lampaert+, JSSC’95], [Strasser+, ICCAD’08], [Ma+, TCAD’11], [Wu+, ICCAD’12], [Lin+, TCAD’16], [Ou+, TCAD’16]

Limitations of previous approaches

ü Efficiency and scalability issues for stochastic or enumerative approaches ü Still limited to consider complex scenarios and characteristics unique to analog designs, which can contribute to better layout quality

4

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SLIDE 5

Introduction

Analog circuits often contain different types of devices Sometimes overlaps are allowed and beneficial Circuit example: capacitive-coupled OTA

ü 30% and 4% area and wirelength reductions, respectively

5

VDD

VBP VBN VBN VBN CC CC CF CF Cs Cs CMFB Bias and CMFB not shown VIP VIN VOP VON 30% area reduction

Layout Phase Margin (deg.) Unity Gain Bandwidth (MHz) Loop Gain (dB) Non-overlap 71.9 103.7 36.3

  • verlap

71.5 105.4 36.3

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SLIDE 6

Introduction

Circuit example: current-controlled ring oscillator (CCO)

ü 30% and 20% area and wirelength reductions, respectively

6 Layout Center Frequency (fCCO) (kHz) Tuning Gain (kCCO) (THz/A) Non-overlap 609 0.89

  • verlap

610 0.90

ICTRL CCO Delay Cell O O ICTRL I I CL CL

30% area reduction

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SLIDE 7

Our Contributions

Consider device-specific overlapping in analog circuits during placement, which offers high flexibility for layout optimization

ü Devices that are insensitive to coupling and built on mutually exclusive layers are allowed to overlap

A holistic analytical framework to solve the device layer-aware analog placement problem An analog global router is developed to verify the routability of our device layer-aware placement results

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SLIDE 8

Preliminary

Type I devices can overlap Type II devices without degrading circuit performance Device types are specified by circuit designers

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Vcmi

Vo- Vo+

Vin- Vcmfb Vin+ Vb M1 M2 M7 M8 M3 M4 M5 M6 Type II devices: built only with metal and via layers, and not sensitive to coupling, e.g. some metal-oxide-metal capacitors Type III devices: occupying not only the metal and via layers but also substrate and polysilicon layers,

  • r the device that is critical and sensitive to

coupling, e.g. some pre-laid-out sub-circuits or sensitive devices Type I devices: built without metal or via layers, and not sensitive to coupling, e.g. some transistors and resistors

An analog circuit example

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SLIDE 9

Device Layer-Aware Analog Placement

Inputs:

ü Circuit netlist ü Device sizes and designer specified device types ü Analog layout constraints (e.g., symmetry) ü Placement boundary (as generated from desired utilization rate and aspect ratio)

Output: a legal placement solution Objectives:

ü Total area ü Total wirelength

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Circuit Netlist Placement Boundary Placement Result Device Layer-Aware Analog Placement Device Types & Shapes Layout Constraints Global Placement

Constraint Graph Construction Symmetry-Aware Legalization

Legalization Detailed Placement

CG-based Non-linear Optimization Adjust Coefficients in Objective

Overall flow

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SLIDE 10

Device Layer-Aware Analog Placement

Constraints:

ü Symmetric device group shares a common symmetric axis in the placement ü Device-specific overlapping constraints:

  • Devices built by mutually exclusive manufacturing layers and insensitive to coupling are

allowed to overlap each other; while others are not

ü Placement boundary constraint

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3 1 2 6 7 8 5 10 9 4

An analog placement example a symmetric group with vertical symmetric axis

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SLIDE 11

Global Placement

We relax the constraints into penalties in the objective, and transform the problem into an unconstrained nonlinear optimization problem Objective: Wirelength term (half-perimeter wirelength): Device-specific overlap penalty:

11

!"#$%&'($ = *

+, + . / * 0, + " / * 123 + % / * 456 7

+ *

456 8

*

+, = Σ:;(max @∈:; B@ − min @∈:; B@ + max @∈:; F@ − min @∈:; F@)

*

0, = H @,J ∈,

!@,J

7 / !@,J 8

!@,J

7 = max min B@ + K@ − BJ, BJ + K J − B@, K@, K J), 0

!@,J

8 = max min F@ + ℎ@ − FJ, FJ + ℎJ − F@, ℎ@, ℎJ), 0

A B

OA,B x = xA+wA-xB OA,B y = hB

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SLIDE 12

Global Placement

Asymmetry penalty: Out of boundary penalty:

12

!

"#$ %

= '

()∈+

'

,,. ∈()

/

0, + 0. − 2 4 05

6 7 +

8, − 8.

7 + ' ,∈()

9

0, − 05

6 7

!

:;< = ' ,∈<

max 0@ − 0,, 0 + max 0, + B, − 0C, 0 + max 8@ − 8,, 0 + max 8, + ℎ, − 8C, 0

(xA,yA) xk c (xB,yB) (xC,yC) A B C i

xL xH xi

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SLIDE 13

Global Placement

Log-sum-exp (LSE) to smooth max and min functions The unconstrained nonlinear optimization problem is solved with nonlinear conjugate gradient method provided by WNLIB Iteratively update the weights of different terms in the objectives

ü The weight of the wirelength term is larger than other weights at the beginning ü Weights of other terms are increased gradually, until the penalties are below certain thresholds ü The algorithm stops when all the penalties are below the preset thresholds, or after it reaches the preset max. #iterations

13 WNLIB: W. Naylor and B. Chapman, http://www.willnaylor.com/wnlib.html

Smoothed max

*

+* : - log 0

*

1

2 34 5

Smoothed min

*

+* : −- log 0

*

19

2 34 5

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SLIDE 14

Legalization

Constraint graph construction

ü Plane sweep algorithm [Doenhardt+, TCAD’87] ü Solid edges: horizontal; dashed edges: vertical

Device layer-aware constraint graph construction

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D E C A B

s s

D A B C E

h v

B C A D E Type I Type II Type III D A B C E

sh sv

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SLIDE 15

Legalization

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A D E B C

s s

D A B C E

h v

A D E B C E

s s

D A B C E

h v

A D B C

s s

D A B C E

h v

A D E B C

(a) Global placement result example w/ illegal device overlaps (c) Constraints graphs after greedily determining overlap edges (b) Constraint graphs after applying plane sweep algorithm (d) Constraints graphs after missing positional relationship detection

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SLIDE 16

Legalization

Linear programming (LP)-based legalization to minimize area Decomposed into x- and y- direction sub-problems and solved independently

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Boundary constraints Topology order constraints Symmetry constraints Boundary constraints Topology order constraints Symmetry constraints

Minimize ' Subject to 0 ≤ 12 ≤ ' − 42, ∀7 ∈ 9, 12 + 42 ≤ 1;, ∀<2,; ∈ =>, 12 + 1; + 4

; = 2 A 1B C, ∀ 7, D ∈ EB F,

2 A 12 + 42 = 2 A 1B

C, ∀7 ∈ EB G,

∀EB ∈ =, Minimize H Subject to 0 ≤ I2 ≤ H − ℎ2, ∀7 ∈ 9, I2 + ℎ2 ≤ I;, ∀<2,; ∈ =K, I2 = I;, ∀ 7, D ∈ EB

F, ∀EB ∈ =,

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SLIDE 17

Detailed Placement

LP-based wirelength refinement

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Fixed boundary and topology order constraints Symmetry constraints

Minimize '()*+*,-.ℎ Subject to 0 ≤ 9: ≤ '∗ − =:, ∀( ∈ A, 9: + =: ≤ 9C, ∀*:,C ∈ DE, 0 ≤ F: ≤ G∗ − ℎ:, ∀( ∈ A, F: + ℎ: ≤ FC, ∀*:,C ∈ DH, 9: + 9C + =

C = 2 K 9L M, ∀ (, N ∈ -L O,

2 K 9: + =: = 2 K 9L

M, ∀( ∈ -L P,

F: = FC, ∀ (, N ∈ -L

O,

∀-L ∈ D,

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SLIDE 18

Experimental Results

All algorithms are implemented in C/C++ All experiments are performed on a Linux machine with 3.4GHz Intel(R) core and 32GB memory. Benchmark information

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Design # Devices # Type I Devices # Type II Devices # Type III Devices # Nets

  • pamp

46 42 4 29 gm-C integrator 15 13 2 9 CTDSM 21 6 2 13 27

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SLIDE 19

Experimental Results

Design NLP Without Device Layer Awareness Device Layer-Aware NLP Area (µm2) HPWL (µm) Run-time (s) Area (µm2) HPWL (µm) Run-time (s) Actual Norm. Actual Norm. Actual Norm. Actual Norm. Actual Norm. Actual Norm.

  • pamp

2972.7 1 753.2 1 17.1 1 2369.9 0.797 497.7 0.661 10.9 0.637 gm-C integrator 182.0 1 72.8 1 1.2 1 175.1 0.962 60.5 0.831 1.2 1.000 CTDSM 57454.5 1 3129.4 1 6.5 1 56059.8 0.976 2580.0 0.824 6.5 0.997 Average 1 1 1 0.912 0.772 0.878

Compare effects of device layer awareness

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SLIDE 20

Experimental Results

9% and 23% area and HPWL reductions, respectively, when considering device-specific overlapping

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  • pamp

gm-C integrator CTDSM Circuit Benchmarks 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Normalized Area

NLP Device Layer-Aware NLP

  • pamp

gm-C integrator CTDSM Circuit Benchmarks 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Normalized HPWL

NLP Device Layer-Aware NLP

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SLIDE 21

Experimental Results

To evaluate routing congestion, we develop a maze routing based analog global router Compare global routing results with and without device layer-awareness 18% global routing wirelength reduction

Wirelength

NLP+GR Device layer-aware NLP+GR

Actual Norm. Actual Norm.

  • pamp

839 1 617 0.74 gm-C integrator 89 1 79 0.89 CTDSM 3591 1 3034 0.84 Average 1 0.82

  • pamp

gm-C integrator CTDSM Circuit Benchmarks 0.0 0.2 0.4 0.6 0.8 1.0 1.2

Normalized Global Routing Wirelength

NLP + GR Device Layer-Aware NLP + GR

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SLIDE 22

Experimental Results

Compare with previous MILP-based analog placement [Xu+, ISPD’17] 18X speedup

Design NLP-based Placement MILP-based Placement [Xu+, ISPD’17] Area (µm2) HPWL (µm) Run-time (s) Area (µm2) HPWL (µm) Run-time (s) Actual

  • Norm. Actual
  • Norm. Actual Norm.

Actual Norm. Actual Norm. Actual Norm.

  • pamp

2972.7 1 753.2 1 17.1 1 3295.5 1.11 714.0 0.95 607.2 35.57 gm-C integrator 182.0 1 72.8 1 1.2 1 186.8 1.03 69.0 0.95 20.7 17.21 CTDSM 57454.5 1 3129.4 1 6.5 1 57959.9 1.01 3611.5 1.15 20.5 3.16 Average 1 1 1 1.05 1.02 18.65

  • pamp

gm-C integrator CTDSM Circuit Benchmarks 5 10 15 20 25 30 35 Normalized Runtime

MILP NLP

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SLIDE 23

Summary

We have introduced the device layer-aware analog placement problem A holistic analytical analog placement framework is proposed for the device layer-aware analog placement

ü Non-linear optimization based global placement ü LP-based legalization and detailed placement ü Symmetry constraints in analog layout are honored

Experimental results show that our framework is both efficient and effective

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SLIDE 24

Thank you!

Questions?

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SLIDE 25

Backup slides

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SLIDE 26

Legalization - Constraint Graph Construction

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