Fabless silicon photonics operation and design trends LETI - - PowerPoint PPT Presentation

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fabless silicon photonics operation and design trends
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Fabless silicon photonics operation and design trends LETI - - PowerPoint PPT Presentation

1 July 2018 Fabless silicon photonics operation and design trends LETI INNOVATION DAYS 2018 CONFIDENTIAL Outline Vertical vs. Horizontal / fabless business model Fabless model in photonic integration Fabless silicon photonics


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1 July 2018 CONFIDENTIAL

Fabless silicon photonics operation and design trends

LETI INNOVATION DAYS 2018

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Outline

  • Vertical vs. Horizontal / fabless business model
  • Fabless model in photonic integration
  • Fabless silicon photonics operation
  • Design trends
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Outline

  • Vertical vs. Horizontal / fabless business model
  • Fabless model in photonic integration
  • Fabless silicon photonics operation
  • Design trends
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Understanding fabless integration

Vertical model

✔✔ State-of-the art device ✘✘ Huge investment Test Packaging Fabrication Design Definition Characterization

Traditional optical component manufacturers (lasers, PDs, splitters, AWGs, modulators, etc.)

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Understanding fabless integration (II)

Vertical model

✔✔ State-of-the art device ✘✘ Huge investment

Horizontal model

Test Packaging Fabrication Design Definition Characterization Test Packaging Characterization Fabrication Design Definition ✔ Performing device ✔✔ Low Investment

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Understanding fabless integration (II)

Vertical model

✔✔ State-of-the art device ✘✘ Huge investment

Horizontal model

Test Packaging Fabrication Design Definition Characterization Test Packaging Characterization Foundry Design Definition Fabrication

Fabless model

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Understanding fabless integration (II)

Vertical model

✔✔ State-of-the art device ✘✘ Huge investment

Horizontal model

Test Packaging Fabrication Design Definition Characterization Test Packaging Characterization Foundry Design house Definition Fabrication Design

Fabless model

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Understanding fabless integration (II)

Vertical model

✔✔ State-of-the art device ✘✘ Huge investment

Horizontal model

Test Packaging Fabrication Design Definition Characterization Test Outsourced Semiconductor assembly and test (OSAT) Foundry Design house Definition Fabrication Design Characterization Packaging

Fabless model

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Horizontal business model

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The growth of the fabless model

Source: Statista

In two decades...

  • Pure-play foundry

revenues have grown, becoming the predominant manufacturing model.

  • Wile IDM sales are still

larger given the large concentration in few players, fabless sales have been growing faster and at a more stable rate

  • ver the last two

decades.

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Outline

  • Vertical vs. Horizontal / fabless business model
  • Fabless model in photonic integration
  • Fabless silicon photonics operation
  • Design trends
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PIC technology evolution

1970 1980 1990 2000 2010 2020

EU fabless Investment 100 Gb/s TX/RX InP, 2004 40 Gb/s AOC SOI, 2007

Optical component Manufacturers

Lasers Photodiodes Passives Splitters AWGs VOAs

Beam combiner Si3N4, 2012

Global investment

FBG interrogator InP, 2015 OCT SOI, 2015

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Silicon photonics technology take-up

PUBLICATIONS EACH YEAR

(Conferences not included)

Start of industrial interest

Courtesy Roel Baets, IMEC/UGhent

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PIC market trends

$866M

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Horizontal business model

Photonics lags 30 years behind!

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Outline

  • Vertical vs. Horizontal / fabless business model
  • Fabless model in photonic integration
  • Fabless silicon photonics operation
  • Design trends
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Photonic EDA tools

  • Traditional Electronic Design Automation (EDA) tool vendors are

heavily investing and partnering with smaller photonic design tool vendors.

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Photonic EDA tools (II)

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Fabless Si photonics manufacturing

  • All major CMOS foundries investing, specially in

Asia following IC trends.

  • Proprietary generic processes: passives,

actives (heaters, Ge PDs, Modulators, heterogeneous InP)

  • Extra FEOL modules (SiN, SSC, etc.)
  • BEOL options (Al/Cu, multilayer routing, TSV,

pillars, etc.)

  • Electronic-Photonic co-design

Source: IC Insights

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Fabless Si photonics manufacturing (II)

  • Different software versions of Process Design Kits (PDKs) in

place at most foundries, compiling design libraries with many mature building blocks for several processes.

  • Multi-Project Wafer (MPW) runs available directly or through

brokers for low-cost prototyping.

  • R&D foundries setting up strategic agreements to transfer

process and allow to scale-up production.

VLC Photonics technical foundries report:

  • 35 silicon photonic

foundries, 6 brokers

  • Contact info,

capabilities, & PIC developments

  • 180 pages & +650

references

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Challenges in fabrication

  • Lack of updated information & roadmaps
  • PDK availability & BB validation
  • Turn around (cycle) time & delays
  • Fabrication reporting
  • Performance and delivery guarantees
  • Wavelength range
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Test and Packaging

Back-end (post fab) processes comprise:

  • Wafer metrology and probing
  • Wafer back grinding (thinning) and dicing/cleaving
  • Bare die characterization
  • Packaging into component
  • Component testing
  • Assembly into module

Challenges in photonics still remain:

  • High cost contribution at the back-end
  • On wafer electrical+optical testing
  • Package & assembly scalability
  • Lack or fragmentation of standards
  • DC+RF+optical package design & multiphysics
  • Small pool of expertise and providers
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Outline

  • Vertical vs. Horizontal / fabless business model
  • Fabless model in photonic integration
  • Fabless silicon photonics operation
  • Design trends
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PIC design challenges

  • IP on building blocks / PDKs
  • DRC validation & routing automatization
  • Workfmow standardization & tool interfacing
  • Software licensing models and incumbent pricing
  • Training & documentation
  • Skilled workforce
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Design company trends

Company Type Characteristics Typical size ID design consultants 1-2 person operation focusing on consulting on particular specialties 0.2 to 0.5M € PIC design house Always fabless, 3-25 people, sometimes also brokers fabrication or

  • ther services

0.5 to 2M € IP / Technology licensing company Usually focused on one technology or product area, engineering oriented management 2 to 15M € Fabless chip firm Growing fast to a niche product or market; usually fabless, strong marketing, product development and distribution departments, 20-200 people < 200M €

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IP approach in photonic integration

  • Design IP is a large business in

semiconductor markets.

  • IP owned by:

–

Foundries

–

Fabless fjrms

–

EDA vendors

Source: Semico research Source: IBS Source: Mentor

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IP approach in photonic integration

  • Photonics still lacks such business model, mainly due to:

–

Lack of market volume and enough licensee base,

–

Low maturity of fabrication processes, risky and expensive IP development,

–

IP usually limited to building blocks, not circuits,

–

Diffjcult IP usage, checking and enforcing,

–

Expensive patent/semiconductor topography registration, maintenance and defence, specially for SMEs. Fabless firms Foundries EDA vendors

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Summary and take-aways

  • Photonic integration is maturing very quickly due to growing

market demands, and silicon photonics is profjting from all experience of the CMOS world.

  • The fabless model is being successfully replicated in the

photonic integration fjeld.

  • Main technical and business challenges remain on the back-

end processes.

  • On the design side, the photonics EDA market is quickly

consolidating, while design IP will take longer to become a market reality.

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info@vlcphotonics.com

Contact details

www.vlcphotonics.com @vlcphotonics linkedin.com/company/vlc-photonics

Thank you for your attention!