Material Design Fabrication Properties Considerations Assembly - PowerPoint PPT Presentation
Material Design Fabrication Properties Considerations Assembly Tips Questions Whenever two materials have different coefficients of thermal expansion, temperature changes create mechanical stress. The mechanical stress will cause PCB
Material Design Fabrication Properties Considerations Assembly Tips Questions
Whenever two materials have different coefficients of thermal expansion, temperature changes create mechanical stress. The mechanical stress will cause PCB reliability issues.
Simulate Estimate
IPC IPC 2152 2221
°C | Amperes | mils | Ounces/Foot 2 UltraCAD.com/articles/pcbtempr.pdf
Etching Electroplating
• Etching is hard! • Heavy copper internal layers • Require high-resin prepreg • Heavy copper outer-layers • Uneven board • Difficult to Silk-screen • Difficult to Solder-Mask
• Heavy Copper Conducts Heat Too Well • Custom reflow profiles • Hand Soldering • Rework Nightmare
2 oz 1 oz 1 oz 2 oz
Heavy Copper Stackup Specifications Q: How do I specific heavy copper in my stackup? Should I tell my fabricator that I want 2 oz. plated up to 3 oz. or let the board shop decide?
Embedded Copper / Bus Bar Q: When would you recommend a bus-bar or embedded copper instead of heavy copper?
Trace and Space Minimums
Greg Ziraldo gziraldo@aapcb.com 800-838-5650
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