Metro IMAPS Vendor Day Introduction to High Temperature Electronics - - PowerPoint PPT Presentation

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Metro IMAPS Vendor Day Introduction to High Temperature Electronics - - PowerPoint PPT Presentation

Metro IMAPS Vendor Day Introduction to High Temperature Electronics By Tom Terlizzi GM Systems November 19, 2013 Clarion Hotel, Ronkonkoma, N.Y PURPOSE A BRIEF INTRODUCTION INTO THE WORLD OF HIGH TEMPERATURE ELECTRONICS 2 AGENDA


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Introduction to High Temperature Electronics

Metro IMAPS Vendor Day

By Tom Terlizzi GM Systems November 19, 2013 Clarion Hotel, Ronkonkoma, N.Y

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SLIDE 2

PURPOSE

◆ A BRIEF INTRODUCTION INTO THE WORLD

OF HIGH TEMPERATURE ELECTRONICS

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AGENDA

◆ DEFINE HIGH TEMPERATURE ELECTRONICS ◆ DESCRIBE SOME APLICATIONS

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WHAT ARE TYPICAL INTEGRATED CIRCUIT MILITARY OPERATING TEMPERATURE RANGES?

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MAXIMUM JUNCTION AND STORAGE TEMPERATURE 150oC MAXIMUM OPERATING TEMPERATURE 125oC

MIL-PRF-38535

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DEFINITION OF HIGH TEMPERATURE ELECTRONICS?

◆ NO INDUSTRY STANDARDS OR AGREEMENT ◆ “ELECTRONICS OPERATING AT TEMPERATURES IN

EXCESS OF THOSE NORMALLY ENCONTERED BY CONVENTIONAL SILICON-BASED SEMICONDUCTORS OR THEIR AUXILLARY COMPONENTS.”1

◆ TYPICALLY >125oC OR >150oC BUT SOME REPORTED

LAB WORK TO 600oC.

1 “High Temperature Electronics” By F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski, page 2

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JET ENGINE TEST

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JET ENGINE TEST STAND ROTOR JET ENGINE CROSS SECTION

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TELEMETRY HYBRID CROSS SECTION

7 ALUMINUM WIRE BONDABLE THICK FILM GOLD 1 MIL GOLD WIRE FROM SUBSTRATE TO PINS 1 MIL ALUMINUM WIRE FROM IC’S, THIN FILM RESISTORS AND TRANSISTORS TO a THICK FILM SUBSTRATE PLUG IN METAL HYBRID HERMETIC SIDE WALL DIP PACKAGE THICK FILM SUBSTRATE MOUNTED WITH THIXOTROPIC EPOXY TO PACKAGE BASE

◆ 150oC & 20KG’S FOR >2000 HOURS ◆ MONOMETALLIC ON SEMI’S AND CHIP RESISTORS

◆ Centrifuge calculator available at:

http://www.calctool.org/CALC/phys/newtonian/centrifugal

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JET ENGINE TELEMETRY SYSTEM

8 TELEMTRY HYBRID

US PATENT 20080224845 A1

  • R. BIRES - PRATT AND WHITNEY
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COMMERCIALLY AVAILABLE TELEMETRY SYSTEMS

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DOWNHOLE APPLICATIONS

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DOWNHOLE APPLICATIONS

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APPROXIMATELY ~20oC INCREASE IN TEMPERATURE PER KILOMETER DEPTH

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NASA HIGH TEMPERATURE ELECTRONICS

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NASA HIGH TEMPERATURE ELECTRONICS

13 High-Temperature Electronics—A Role for Wide Bandgap Semiconductors PHILIP G. NEUDECK, SENIOR MEMBER, IEEE, ROBERT S. OKOJIE, MEMBER, IEEE, AND LIANG-YU CHEN

WBG =Wide Band Gap=GaN or SiC BS = BULK SILICON SOI=SILICON ON INSULATOR

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IMAPS HiTEC 2014

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