[PPT] - R e c e n t P r o g r e s s i n S i l i c o n PowerPoint Presentation

SLIDE 1

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 1

R e c e n t P r

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r e s s i n S i l i c

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u l e s a n d S c i n t i l l a t

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C a l

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i me t r y

J e r e m i a h M a n s C D 1 D i r e c t

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’ s R e v i e w M a r c h 1 9 , 2 1 9

SLIDE 2

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 2

Recent Updates on Silicon Module Constructjon
Recent Updates on Scintjllator, SiPMs, and Tile

Modules

Outline

P C B B a s e p l a t e S i l i c

n

S e n s

r

G l u e L a y e r

SLIDE 3

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 3

Module Constructjon Strategy

UCSB – Internatjonal Lead Module

Assembly Center (MAC)



Responsible for developing procedures, baseline sofuware tools, specifying equipment, defjning site commissioning protocols

For both US and internatjonal sites (IHEP-Beijing,

Taiwan NTU/NCU, India BARC)



Responsible for assembly of limited-run odd- sized modules

Texas Tech University



Standard hadronic modules, high-throughput center

Carnegie Mellon



Standard hadronic modules, high-throughput center

Multj-site solutjon provides

redundency in case of risk, opportunity for acceleratjon of productjon if required

SLIDE 4

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 4

Studies at UCSB

Some concern with leakage

currents in testbeam modules early in 2018



Observatjons have been understood, important implicatjons of humidity and “burn-in” fjrst high-voltage cycle

Excellent sensor-placement

accuracy measured throughout productjon

Humidity dependence

± 20 mm ± 20 mm

SLIDE 5

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 5

Mechanical Studies

PCB Baseplate Modules PCB Baseplate Modules Cu Baseplate Modules Cu Baseplate Modules

Results



Modules all within

150 μm and +200 μm

(σ~100 μm)



most in range ±100 μm

Module heights measured for 19
f the 6” modules

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All have 300 mm sensors



13 have 1.20 mm thick Cu baseplates of which 7 had two Au/Kapton layers

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6 used 0.90 mm thick PCB baseplates

SLIDE 6

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 6

8” Module Assembly Status

New 8’’ fjxtures and tooling

delivered by shop



Wirebonding fjxture, Carrier Tray



PCB Tray, PCB Pick up tool

Received PCB Baseplates

from FNAL

Currently practjcing

building dummy modules with acrylic PCB layers and dummy G-10 baseplates to qualify gluing patuerns.

Next step will be to build

with an HPK dummy sensor and a PCB with 2 bad SKIROC chips.



Expect to be complete by end of month

SLIDE 7

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 7

MAC Documentatjon

T h i s p a g e c

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t h e s e t u p

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H i g h

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u l e A s s e m b l y C e n t e r s . I f y

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h a v e q u e s t i

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s t h a t a r e n ' t c

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e r e d h e r e , p l e a s e c h e c k t h e F A Q p a g e . I f y

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r q u e s t i

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i s n

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a n s w e r e d t h e r e , f e e l f r e e t

p
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t i t i n t h e Q & A p a g e ( i f i t ' s n

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a l r e a d y t h e r e . ) P a g e C

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t e n t s E q u i p m e n t G a n t r y V a c u u m s y s t e m G l u e d i s p e n s i n g s y s t e m Wi r e b

n

d e r P l a t e s a n d t

l

i n g P u l l t e s t e r E n c a p s u l a t i

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g a n t r y M i c r

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p

e (

p

t i c a l i n s p e c t i

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) O G T / O G P E l e c t r i c a l t e s t s t a n d s ( s i n g l e m

d

u l e ) K e i t h l e y 2 4 1 S

u

r c e M e t e r R a s p b e r r y P i I n t e r p

s

e r F i l t e r T h e r m a l c y c l i n g a n d t e s t i n g S

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t w a r e L a b V i e w F l

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p l a n

E q u i p m e n t

B a c k t

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T h i s s e c t i

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t a i n s i n f

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m a t i

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t t h e e q u i p m e n t u s e d b y M

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u l e A s s e m b l y C e n t e r s . I t w i l l i n c l u d e m

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e l n u m b e r s , w e i g h t a n d fl

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t h e e q u i p m e n t . F

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u s i n g t h e e q u i p m e n t

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c e i t ' s s e t u p , s e e t h e p a g e s

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u l e t e s t i n g .

G a n t r y

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5 g a n t r y ( s e r i e s 1 , 7 5 m m x 7 5 m m t r a v e l a r e a . ) M A C s s h

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e>H G C A L Wi k i H

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s t a n t i n e O d e g a r d

SLIDE 8

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 8

TTU Status

HESSE Bondjet BJ820 Wire bonder

delivered and commissioning is planned for June 2019. Royce 610 pull tester is also delivered

AEROTECH AGS10,000 (1.25 m x 1.25

m) Gantry is delivered and placed in the cleanroom. Working on commissioning, including the gantry head accessories, this month (March 2019)

Vacuum and compressed air systems

are commissioned

Filter replacement and cleanroom
ffjcial certjfjcatjon will follow afuer all

major equipment is moved in. Monitoring systems are in place.

New personnel joined the technical

team full-tjme (S. Undleeb)

Room 1: Wire bonder Room 2: Gantry

SLIDE 9

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 9

CMU Status

Expansion of Cleanroom #1 (100 m2)
complete. Sealing and cleaning on-going.

Monitoring setup in place: 8 temp/humidity monitors with logging and 2 webcams

Constructjon for Cleanroom #2 (60 m2) to

start shortly. Completjon expected in April

HESSE Bondjet BJ820 Wire bonder

delivered and placed in cleanroom. 3-day setup and on-site training by HESSE to

ccur end of March
Royce 610 pull tester and epoxy dispenser

close to be ordered

AEROTECH AGS10,000 (1.25 m x 1.25 m)

Gantry is expected in June 2019

New electronics engineer hired (start

March 15) to join Eric Day (mechanical) in technical team

SLIDE 10

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 10

Scintillator Calorimetry

SLIDE 11

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 11

Steps of Contructjon

Tile productjon : injectjon-molding

(low-dose) and machined cast scintjllator (high-dose)

Tile wrapping with ESR foil

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Mechanical and light yield QC

SiPM productjon

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Batch QC

Mountjng of components onto the

tjle PCB



QC of assembled tjle PCB (inc full SiPM QC)

Mountjng of tjles onto tjle PCB to

create a tjle module

Integratjon into a cassetue with

motherboards and cables

SLIDE 12

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 13

Tile Wrapping R&D

Studying use of

punch/die for ESR cuttjng



High throughput, low dust compared with laser cuttjng

Studying use of hydroforming to create

pocket for scintjllator tjles



Forms sharp creases, possibility for higher precision than ‘candy machine’ folding processes

ESR in-feed Punched material

utlet

Replaceable die for each size

SLIDE 13

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 14

SiPM R&D [Notre Dame]

HE SiPM used as baseline in

TDR

HPK has developed new

“HDR2” SiPM with lower cross-talk and betuer PDE



Vbd 36V vs 62V

Lower power, easier to regulate



Temperature coeffjcient decreases proportjonally to Vbd (36 mV/K)



Radiatjon-induced Vbd shifu smaller (0.3V vs 1V)

Signifjcant work ongoing for

packaging of SiPM



Standard SMT package has thermal resistance 100 K/W



“Through-Silicon-Via” package has <4 K/W, some efgects of radiatjon on glass window

SLIDE 14

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 15

Tileboard QC R&D [Maryland]

QC of tjleboards before mountjng scintjllator tjles is point

where any issues with SiPMs are identjfjed

Maryland developing a test stand which should be capable of

SiPM checkout and also channel calibratjon over a wide dynamic range using geometry (1/R2)

SLIDE 15

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 16

Tile mountjng R&D [FNAL]

Pick and place system set up at

FNAL to assemble tjle modules using dummy tjles, PCBs

Studying concept of using

phase-change fjlm instead of glue

SLIDE 16

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 17

Thermal Tests

Thermal teststand

at Fermilab



Full cycle to -30oC

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validate SiPM cooling through PCB using thermal vias

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max increase with load: 2K



No strong gradients



Study of impact of screws and thermal foams

SLIDE 17

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 18

Cassetue Integratjon

Tileboards must connect to

motherboards via cable structures

US (FSU, Minnesota) working on

detailed mechanical design, to be implemented in mockup, prototype 1

SLIDE 18

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 19

System Integratjon and Emulatjon

US (KSU, Baylor, Minnesota,

FNAL) leading the development

f emulators and testers which

reproduce the expected behavior of HGCROCV2 and the concentrators

Allows system tests,

development of necessary control sofuware and fjrmware, further study of system issues

SLIDE 19

Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 20

Conclusion

Signifjcant progress made on module constructjon

since June 2018

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Large scale productjon of 6” modules

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Development of 8” module tooling

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Procurement of major equipment for CMU and TTU module assembly facilitjes

Scintjllator efgort making progress on all fronts



Tile-wrapping and QC

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Tile-board QC



Tile mountjng to create tjle-modules

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Tile-module thermal performance

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Cassetue integratjon → mockup

Efgort is very well on-track for CD-2 review next year