Resistive MPGDs
Screen printed resistors versus DLC Rui De Oliveira workshop on the upgrade of T2K March 20-21
Resistive MPGDs Screen printed resistors versus DLC Rui De Oliveira - - PowerPoint PPT Presentation
Resistive MPGDs Screen printed resistors versus DLC Rui De Oliveira workshop on the upgrade of T2K March 20-21 MM Projects @ CERN and MPGD R&D Medium rates detectors High rate detectors Screen printed resistor Spark study
Screen printed resistors versus DLC Rui De Oliveira workshop on the upgrade of T2K March 20-21
resistor family
screen printed
screen printed
screen printed
screen printed
DLC
gap filling
screen printed
gap filling
resistive Kapton
screen printed
DLC
Screen printed
Screen printed
ITO
DLC
DLC
DLC
DLC
Resistive MPGD projects at CERN
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BULK or Standard ? “bulk” Micromegas
Mesh embedded in pillars
“Standard” Micromegas
Mesh separated from pillars
to avoid dust trapping
Limiting the size to 550mm x 550mm active area for optimum yield
guarantee amplification gap constant)
0 to 100khz/cm2
DLC
Screen printing
Resistor scheme in Micromegas detectors for medium rates
ATLAS Upgrade Week, DESY, 23.04.2010 Joerg Wotschack and all
8 Rui De Oliveira
Read-out flex or board
Glue Copper 5um /APICAL 50um/DLC DLC
9 Rui De Oliveira
Vacuum Press gluing
10 Rui De Oliveira
Top copper pattern + APICAL etch Detector ready
Max size today : 1.2m x 0.55m Real limit 1.6mx 0.55m Cheapest MPGD detector Flexible or rigid detector Radio pure materials possible thickness of 0.2mm possible
3/20/2017 11
Giovanni Bencivenni and all 2016
From 100Khz to “100Mhz/cm2”
Embedded resistors are mandatory for High rate applications
2 layers Surface resistor
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and its breakdown voltage by design
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Bare PCB Coverlay gluing + via fill Inner resistor printing Coverlay gluing + via fill +top resistive layer print
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Bare PCB Coverlay gluing + via fill Inner resistor printing Coverlay gluing + via fill +top resistive layer print
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Bare PCB Coverlay gluing + via fill Inner resistor printing Coverlay gluing + via fill +top resistive layer print
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Bare PCB Coverlay gluing + via fill Inner resistor printing Coverlay gluing + via fill +top resistive layer print Ready for BULK process
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3/20/2017 19
Max Chefdeville and all Lapp dec 2015
20 Rui De Oliveira
5um copper/50um APICAL/DLC Base material , DLC (100 Mohms/square) DLC1
21 Rui De Oliveira
Glue DLC2 (100M) layer (pre drilled) on DLC1(100M) via filling with silver paste (yellow) Screen printed resistors above 10K/square are not behaving correctly in this multilayer configuration
DLC1 DLC2
22 Rui De Oliveira
Glue a flex read-out circuit (Strip or pad) pre drilled (green) on DLC2 via filling with silver paste (yellow)
DLC1 DLC2
23 Rui De Oliveira
Top layer patterning APICAL etching
High rates Digital read-out 2 layers screen printed Single layer protection Screen printed or DLC
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High rates Analog read-out 2 layers DLC (R&D in progress) Medium rates
Screen printing
DLC
Masahiro Yamatani, Tatsuya Masubuchi ICEPP, University of Tokyo
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Spark discharge test Setup
✴ Keithley for voltage adding (300,500,800 V) ✴ 2 probes connected to Resistive strips
→ One is attached on HV line side → Other one is on the strips (floating for spark)
✴ Checked resistivity/strip vs surface status by SEM GND HV (300~800V) Resistive strip on PCB ←Attached Spark→ [MΩ/strip] ✴ Optional current limit (10uA, 100uA, …)
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Point : 5 Voltage : 300 V Resistance : 4.41 MΩ Current limit : 10 μA
Point : 8 Voltage : 300 V Resistance : 4.41 MΩ Current limit : 10 μA
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3 2
Point : 2 Voltage : 900 V Resistance : 4.41 MΩ Current limit : 10 μA
3 3
Point : 4 Voltage : 500 V Resistance : 1.3 MΩ Current limit : 10 μA
3 4
Point : 9 Voltage : 900 V Resistance : 0.9 MΩ Current limit : 100 μA
3 5
Point : 12 Voltage : 500 V Resistance : 1.2 MΩ Current limit : 100 μA
Bulk technology
STD Micromegas
u-Rwell