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This research has been funded by the European Union’s Horizon 2020 Research and Innovation Programme under the Marie Sklodowska-Curie Grant Agreement No 841261 (DarkSphere)
This research has been funded by the European Unions Horizon 2020 - - PowerPoint PPT Presentation
This research has been funded by the European Unions Horizon 2020 Research and Innovation Programme under the Marie Sklodowska-Curie Grant Agreement No 841261 (DarkSphere) 1 NEWS-G NEWS-G collaboration Searching for Canada, France, Greece,
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This research has been funded by the European Union’s Horizon 2020 Research and Innovation Programme under the Marie Sklodowska-Curie Grant Agreement No 841261 (DarkSphere)
NEWS-G collaboration Canada, France, Greece, UK, USA
6th collaboration meeting LPSC, Grenoble June 2019
I.Giomataris et al ,JINST,2008, P09007
Anode
Supporting tip
Wire
surface Supporting Rod
coating
The sensor
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Polyethylene 30 cm Lead 15cm Copper 8 cm Sedine 60 cm Ø SPC
deposit removal
NEWS-G (2017)
Crest-II (2015) DAMIC CDMS-lite
Gas Mixture: Ne+0.7%CH4 at 3.1 bar (280 g) Exposure: 9.6 kg*days (34.1 live-days x 0.28 kg)
NEWS-G collaboration, Astropart. Phys. 97, 54 (2018), doi: 10.1016/j.astropartphys.2017.10.009
CH4 Ne+ 6%CH4
Snoglobe at LSM Preliminary NEWS-G Snolab
Preliminary Snoglobe at LSM
Low E-field region
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Giganon, A. et al, 2017. “A Multiball Read-out for the Spherical Proportional Counter.”, JINST
Giganon, A. et al, 2017. “A Multiball Read-out for the Spherical Proportional Counter.”, JINST
S i n g l e A C H I N O S
He:Ar:CH4(80:11:9) 640 mbar HV1 = 2015 V HV2 = -200 V 2 mm Ø anodes
Giganon, A. et al, 2017. “A Multiball Read-out for the Spherical Proportional Counter.”, JINST
He:Ar:CH4 (56:37:7) 455 mbar HV1 = 1100 V, HV2 = -100 V 2 mm Ø anodes
Measurement of the 5.9 keV 55Fe X-ray line
5.9 keV Escape peak
3D design Implemented modules using 3D printing
600 mbar He+10% CH4 without contaminant filtering 600 mbar He+10% CH4 with contaminant filtering 9310 ADU 8.9% (σ)
1.49 keV Al Fluorescence 5.9 keV
55Fe
5.9 keV
55Fe
1.49 keV Al Fluorescence
Using Oxisorb
Contaminants: Oxygen, Water, electronegative gases... Purifiers:
4620 ADU 22.4% (σ)
Charge Loss and Oxygen Concentration
passes circulated through MicroTorr Purifier
Tunable transmission to control the mean number of electrons Common DAQ for timing analysis between two channels Parallel photo-detector to tag laser events A powerful UV laser capable of extracting 100s
extracted from the surface of the sphere: Poisson
S avalanche pairs: Nth convolution of Polya
N photo-electrons
convolved with a Gaussian to model baseline noise
Laser in pulsed mode fixed to a low intensity
Fit results θ = 0.09 ±0.02 <G> = 30.26 ± 0.21 ADU χ2/ndf = 0.97
irradiating Ca power with a high flux of fast neutrons
calibrations, can find W (mean Ionization energy) with 1% precision for target gas, and set upper limits on F (Fano factor) L-Shell: 270 eV W = 27.6 eV/pair F = 0.26 K-Shell: 2.82 keV W = 27.6 eV/pair* F = 0.19 Fit of 270 eV and 2.82 lines with flat background Detector response modeled:
(COM-Poisson)
*The W-value at 2.82 keV was calculated directly from <G> and fixed for this fit
37Ar 2.82 keV corrected
The laser can be used to monitor the detector response during physics runs Long-term fluctuations in gain can be caused by temperature changes, O2 contamination, sensor damage... Laser monitoring data could even be used to correct for long-term fluctuations
37Ar 2.82 keV peak
Laser events
5.5 MeV 6.0 MeV 7.7 MeV 5.3 MeV
○ Spun into two hemispheres
muon spallation
○ Measured for NEWS-G ~10 μBq/kg ○
210Pb out of equilibrium - 28.5 mBq/kg
electroforming Cu
electroplated to stop Bremsstrahlung X-rays from 210Pb and 210Bi β-decays in copper
surface at LSM: expected background from 210Pb and 210Bi under 1 keV reduced from 4.58 dru<1 keV to 1.96 dru The setup during electroplating at LSM
○ Result is promising for possibly a whole detector electroformed underground
~0.036 mm/day ~1.3 cm/year Plated surface Hemisphere after plating
Preliminary
○ Observed ~600 mBq alpha particles, up from ~1 mBq without filter ○ ~40 days before 222Rn acceptably low, but depositing daughters (e.g. 210Pb)
Daughter nuclei are a problem
capture Rn ○ Side effect, removal of some CH4 from mixtures ○ Looking into optimum temperature of filter
He/CH4 (90/10) 600 mbar HV1=1820 V HV2=+225 V Ball Φ2 mm No OXISORB He/CH4 (90/10) 600 mbar HV1=1840 V HV2=+300 V Ball Φ2 mm OXISORB
5.9 keV (55Fe) 1.49 keV (27Al)
Conversion e-
Improvements
Vacuum conditions
1.E-4 mbar→1.E-5 mbar→1.E-6 mbar Leak Rate ≈ 1.4E-6 mbar*L/s
⇒ Not a dramatic effect
Gas quality Contaminants ~ppm ↓ Oxisorb ~100 ppb ⇒ Big improvement Increased drift velocity less attachment
Rise time vs Amplitude 2D Histo Amplitude 1D Histo Attachment
e
Volume event
Gas filtering
2 measurements of 210Po in our copper. Implied:
Simulation shows this gives 4.58 dru < 1 keV Reduced to 1.96 dru if 500 μm pure copper plated onto surface
XIA UltraLo-1800
https://www.xia.com/ultralo-theory.html See: XMASS collaboration arXiv:1707.06413 107 decays of 210Pb and 210Bi in Cu Walls in 2 bar Ne+10% CH4 Best Estimate of 210Po & 210Pb from two measurements of 210Po
Capacities for a 1 m3 detector in different geometries
rA
≈ 3500 pF ≈ 115 pF
≈ 1.5 pF
Parallel Plate Cylindrical
Spherical
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C~Electronic noise ↑Electronic noise ↑Threshold
– has high reduction potential
most contaminants - 238U, 232Th ect
up
1% H2SO4 in deionised (DI) water ○ Shown to be effective etchant while less aggressive than some alternatives
○ Pump and filter to move electrolyte and remove particulates
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high reduction potential +0.34 V
○ Uranium: -1.80 V ○ Thorium: -1.90 V ○ Lead: -0.44 V ○ All lower than copper → refined during electroplating
electroformed Cu for Majorana Experiment
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○ Removes layer from hemisphere without chemical or mechanical attack ○ Preferentially removes high spots from surface ○ Increases concentration of CuSO4 in electrolyte
(28.2±0.1 μm) polished
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Cu Movement in Electropolishing
○ Removes layer from hemisphere without chemical or mechanical attack ○ Preferentially removes high spots from surface ○ Increases concentration of CuSO4 in electrolyte
(28.2±0.1 μm) polished
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Cu Movement in Electropolishing
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□ Electroplating performed with pulsed
current
□ 0.27 to 0.3 V amplitude in forward and
reverse directions of plating – Established value for copper plating
□ Plating continued for ~15 days □ In total first (second) hemisphere plated
502.1±0.2 μm (539.5±0.2 μm)
□ Passivation with Citric Acid
~0.036 mm/day ~1.3 cm/year
Cu Movement in Electroplating
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□ Next generation of detector will require
even lower background material
□ Two options:
– 6N copper sphere – Electroformed intact sphere
□ 6N more currently favoured; less pure
than electroformed but commercially available and potentially lower cost – Electroformed copper could be the generation after – demonstrated growth ~ 1.3 cm/year – 10 bar, ⌀ 60 cm sphere requires 4 mm walls - ~ 4 months
□ Currently planned to be ⌀ 60 cm, installed
in NEWS-G@LSM shielding
Electroformed copper (PNNL) ~<100 nBq/kg 238U & 232Th
high reduction potential +0.34 V
○ Uranium: -1.80 V ○ Thorium: -1.90 V ○ Lead: -0.44 V ○ All lower than copper → refined during electroplating
electroformed Cu for Majorana Experiment
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North South
Resistive central electrode Spherical metallic anodes Insulated wires Supporting metallic rod