Updates on the FBK and HPK SiPMs and summary of the meeting in - - PowerPoint PPT Presentation

Updates on the FBK and HPK SiPMs and summary of the meeting in Milano-Bicocca

Francesco Terranova PDS Consortium meeting 14 Jan 2020

More details in: A. Montanari, F. Terranova, “Planning for the SiPM tests in the DUNE pre-production phase” to appear in docdb

Hamamatsu (HPK)

• Order for the production of four splits (25 sensors per split)

funded by the University of Milano-Bicocca and placed in October OK

• Order for the production of 250 sensors per split funded by the

Czech DUNE group. Placed at CERN OK

• Frequent contacts between DUNE and Hamamatsu Japan

(through the Italian and US HPK branches) to define the details of the splits. Completed in Dec 2019. OK

• Delivery date: officially confirmed by HPK on 23 Dec 2019: the

25 sensors of the four splits will be delivered in the first half

• f April
• 250 sensors: TBD (most likely in June)

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• All splits will be based on the S13360 chip (Vbk = 50 V

at 300 K), terminal capacitance 1.28 nF per sensor, 61.4 nF per 48 sensors.

• All splits will be based on the HWB technology
• Packaging:

we asked HPK to perform a thermomecanical study on epoxy versus silicon resin (see below). Results indicate that silicon resin is slightly

• better. We chose silicon resin.
• Cell pitch: 50 and 75 mm

[already fixed in July]

• Quenching resistance:

HQR= 4 LQR.

The four HPK spilts:

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• Order for the production of twelve wafers (about 3000 sensors in

total) funded by INFN and placed OK

• This order include the packaging of 25 sensors per split for early

tests and 250 sensors per split for the reliability tests OK

• Frequent contacts between DUNE and FBK to define the details
• f the splits. Decision taken in Dec 2019. OK
• “Standard DUNE split”: 30 mm cell pitch, 6x6 mm2 sensors in

NUV-HD-Cryo. Packaging: epoxy resin in SMD package. Most conservative option (DarkSide-like) fulfilling all DUNE specs

• “Triple trench split” 50 mm, low cross-talk due to additional SiO2

trenches.

• To save time and validate the full chain, the wafer will be

produced by LFoundry (subcontractor of FBK), as for the DUNE mass production.

FBK

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FBK

Delivery schedule: Wafer production: january-march Packaging of 25 sensors per split in FBK at single SiPM level: April. Delivery of 250 sensors: TBD, most likely in June In a nutshell: both FBK and HPK can provide the 25 sensors per split in time for the 60% readiness review (end of May)

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Meeting in Milano-Bicocca

On Dec 12-13, we held in Milano-Bicocca the first meeting of all European groups involved in the PDS. We put special emphasis

• n the activities that may be carried on in Spain (Madrid, Valencia

and Granada), which joined the Consortium very recently. Aim of the workshop:

• Provide a general overview of the status of the PDS and

especially photosensors, cold electronics, warm electronics, integration

• Prepare for the characterization of the splits (see above) and

the sharing of the responsibilities

• Distribute information on the cold electronics in order to set up

standards for

• The characterization of the splits
• The optimization of the cold electronics for FBK and HPK

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• Distribute information on the mechanics of the modules to

prepare the design of the SiPM board and signal lead board

• Discuss integration issues and start the process to identify the

engineer in charge of integration Outcome:

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Contents:

• Identification of the measurements for the 25 sensor split and

sharing of the samples

• Standardization
• f

the procedure for cooling and characterization (instruments and precision)

• Identification of the measurements for the 250 sensor splits

(mostly I-V curves and thermal tests in sensors directly embedded in the SiPM board developed by Milano-Statale)

• Ganging tests with sensors in catalog (e.g. S13360 TSV – Spain
• or S14160 in HWB – Italy) while waiting for the DUNE splits
• Test of final configuration and of a full X-Arapuca by summer
• Test of a half-module by the 90% readiness review

We plan to discuss all these items in a dedicated session (PDS-photosensors) at the next Collaboration Meeting

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