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First reported in 2014.

• T. Fujiwara, et al., IEEE NSS/MIC 2014

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• 1. Glass Substrate
• 2. UV exposure (1st_exp)
• 4. Via etching

(Hydrogen Fluoride wet etching)

• 3. Crystal formation

(heat treatment)

Crystal portion (Li2OSiO2) Photo Mask Via HF etching Cr sputter Grinder Metallize Cu (inside via also) Remove Cr in surface (remains in via)

• 5. Poison Metallization
• 6. Remove metal except in via
• 7. Metallization process II (Cu)
• 8. Selectively etch metal in via

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Etching machine UV exposure machine DC sputtering machine for Cr Laser microscope Plating machine DC sputtering machine for Cu Polishing machine

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8 Smooth electrode: Uniformity of the electric field improves, and the GEM’s stability improves

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• Fig. 2 Gas gain curve

Operation voltage decreased from the past process Fig.1 Pulse height spectra of 5.9 keV Energy resolution 19%, gas gain 10,000

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electron multiplication in gas volume Gas scintillation

Gas molecular

X-ray

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Ar + CF4 is known as a good scintillation gas. Firstly reported by Fraga in 1999[6]

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Large amount of scintillation photons would be produced during Glass GEM’s high gain avalanche process

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Gas scintillation can optically readout with CMOS camera

4000 3000 2000 1000

Intensity

800 700 600 500 400 300 200

Wavelength (nm)

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Outlook of the detector

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13 Glass GEM (100×100mm) dark box Scintillating gas filled chamber X-ray tube

20 kV, 100 uA

CMOS Camera

10 sec integration

mirror Gas scintillation Rotating stage Object (a hornet)

• DAQ and control PC

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Drift gap 5 mm Drift gap 1 mm

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▶ Reconstructed

with 360 X-ray images taken with Glass GEM

▶ 2 sec exposure time ▶ Took 20 minutes ▶ Filtered back projection method ▶ GEMs can easily amplify small

signals with gains of up to 104.

▶ This feature of GEMs is highly

advantageous for large-area soft- X-ray imaging.

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Takeshi Fujiwara